Kupanga ma contract chip ndi mgodi wagolide wa Samsung. Bizinesi iyi imapanga gawo lalikulu la ndalama zake. Chimphona cha ku Korea chikuyeseranso kuti apambane makasitomala ambiri kuchokera kwa mdani wake wamkulu pagawoli, chimphona cha Taiwanese semiconductor TSMC. Qualcomm yakhala ikudaliranso zoyambira za Samsung popanga tchipisi zake kwakanthawi. Nthawi zambiri imagawaniza madongosolo ake pakati pa Samsung ndi TSMC. Samsung idapeza maoda ambiri a Snapdragon 8 Gen 1 chip, mwina ndichifukwa chake Qualcomm idakhala m'modzi mwamakasitomala ake asanu kwanthawi yoyamba.
Zithunzi
Nyuzipepala yaku Korea Yonhap inanena kuti zotsatira zandalama za Samsung kotala loyamba la chaka chino zikuphatikizapo chikalata chomwe chinatchula kuti Qualcomm ndi mmodzi mwa makasitomala asanu apamwamba kwambiri ku Korea panthawiyo. Mwachindunji, ili pachinayi, ndi gawo lofunika kwambiri la Samsung kumbuyo kwake, Samsung Electronics, ndi patsogolo pake. Apple, Best Buy ndi Deutsche Telekom. Kuphatikiza pa tchipisi tamakampani ena, gawo la Samsung la chip limapanganso ma chipset a Exynos omwe (zambiri) zida zimagwiritsa ntchito. Galaxy.
Mutha kukhala ndi chidwi ndi
Ndizokayikitsa ngati Qualcomm ikhalabe pamndandanda wamakasitomala asanu akulu a Samsung. Zikuyembekezeka kuti chip chotsatira cha Qualcomm Snapdragon 8 Gen 1+ idzapangidwa ndi TSMC. Qualcomm akuti akusamukira ku chimphona chaku Taiwan chifukwa chotsika kwambiri Zotuluka Njira ya Samsung ya 4nm.
