Tsekani malonda

Samsung ndi imodzi mwa opanga zazikulu kwambiri za semiconductor chip padziko lapansi. Komabe, kutengera mphamvu yopangira komanso ukadaulo, imatsalira kumbuyo kwa chimphona cha Taiwanese TSMC. Poganizira zovuta zomwe zikuchitika padziko lonse lapansi, chimphona chaku South Korea chalengeza kuti chikukonzekera kuchulukitsa katatu mphamvu zake zopanga pofika 2026.

Samsung idati Lachinayi kuti gawo lake la Samsung Foundry lidzamanganso fakitale imodzi ya chip ndikukulitsa mphamvu zopangira pamalo opangira omwe alipo. Kusunthaku kupangitsa kuti ipikisane bwino ndi mtsogoleri wamsika TSMC ndi Intel Foundry Services yatsopano.

Samsung yakhala ikukambirana ndi akuluakulu aku US kwakanthawi kuti ikulitse fakitale yake ku likulu la Texas ku Austin ndikumanga chomera china ku Texas, Arizona kapena New York. M'mbuyomu, kampaniyo idalengeza kuti ikufuna kugwiritsa ntchito ndalama zopitilira 150 biliyoni (pafupifupi 3,3 thililiyoni akorona) kuti ikhale wopanga wamkulu kwambiri padziko lonse lapansi wa tchipisi ta semiconductor.

Samsung Foundry pakadali pano imapanga tchipisi tamakasitomala osiyanasiyana, kuphatikiza zimphona monga IBM, Nvidia kapena Qualcomm. Kampaniyo posachedwapa idalengeza kuti yayamba kupanga tchipisi cha 4nm komanso kuti tchipisi ta 3nm tidzakhalapo mu theka lachiwiri la chaka chamawa.

Mitu: ,

Zowerengedwa kwambiri masiku ano

.