Monga mukudziwa, Samsung ndi imodzi mwa opanga zazikulu kwambiri padziko lapansi. Koma makamaka chifukwa chakulamulira kwake kwathunthu pamsika wamakumbukiro. Zimapanganso tchipisi tamakampani monga NVIDIA, Apple kapena Qualcomm, yomwe ilibe mizere yawoyawo yopanga. Ndipo m'derali akufuna kulimbikitsa udindo wake posachedwa komanso kuyandikira pafupi ndi kampani yayikulu kwambiri padziko lonse lapansi yopanga ma chip chip padziko lonse lapansi, TSMC. Anayenera kuyika pambali madola mabiliyoni 116 (pafupifupi akorona 2,6 thililiyoni) kuti achite izi.
Samsung yayika ndalama zambiri posachedwa kuti igwirizane ndi TSMC pantchito yopanga chip contract. Komabe, idakali kumbuyo kwake - TSMC idagwira msika wopitilira theka la msika chaka chatha, pomwe chimphona chaukadaulo waku South Korea chidayenera kukhazikika pa 18 peresenti.
Mutha kukhala ndi chidwi ndi
Komabe, akufuna kusintha izi ndipo wasankha kuyika ndalama zokwana madola mabiliyoni 116 mubizinesi ya chip ya m'badwo wotsatira ndipo, ngati sangapambane ndi TSMC, ndiye kuti mukwaniritse. Malinga ndi Bloomberg, Samsung ikukonzekera kuyambitsa kupanga tchipisi tambiri potengera njira ya 2022nm pofika 3.
TSMC ikuyembekeza kutha kupereka tchipisi ta 3nm kwa makasitomala ake mu theka lachiwiri la chaka chamawa, pafupifupi nthawi yofanana ndi Samsung. Komabe, onsewa akufuna kugwiritsa ntchito matekinoloje osiyanasiyana pakupanga kwawo. Samsung iyenera kugwiritsa ntchito kwa iwo ukadaulo womwe wapangidwa kwanthawi yayitali wotchedwa Gate-All-Around (GAA), womwe, malinga ndi owonera ambiri, ukhoza kusintha bizinesiyo. Izi ndichifukwa choti imathandizira kuyenda bwino kwazomwe zikuchitika pamakanema, imachepetsa kugwiritsa ntchito mphamvu ndikuchepetsa gawo la chip.
TSMC ikuwoneka kuti ikutsatira ukadaulo wotsimikizika wa FinFet. Akuyembekezeka kugwiritsa ntchito ukadaulo wa GAA kupanga tchipisi ta 2024nm mu 2, koma malinga ndi akatswiri ena zitha kukhala kuyambira theka lachiwiri la chaka chatha.
