Qualcomm yatsimikizira kuti msonkhano wake wamasiku awiri wa Tech Summit udzachitika mu Disembala, monga momwe amaganizira masabata angapo apitawa. Zidzakhala ndendende pa 1 December. Ngakhale kampaniyo sinatsimikizire izi, iwulula chip chatsopano cha Snapdragon 875 kwa anthu pamwambo wokonzedwa ndi digito.
Malinga ndi malipoti osavomerezeka mpaka pano, Snapdragon 875 ikhala chip choyamba cha Qualcomm cha 5nm. Idzakhala ndi purosesa imodzi ya Cortex-X1, ma cores atatu a Cortex-78 ndi ma cores anayi a Cortex-A55. Akuti Snapdragon X5 60G modem idzaphatikizidwa mmenemo.
Mutha kukhala ndi chidwi ndi
Chip, chomwe chiyenera kupangidwa ndi Samsung's semiconductor division Samsung Foundry, idzakhala 10% mofulumira kuposa Snapdragon 865 komanso pafupifupi 20% yogwira ntchito bwino pakugwiritsa ntchito mphamvu.
Sizikudziwika pakadali pano ngati Qualcomm akufuna kubweretsa tchipisi china pamwambowu. Zikuwoneka kuti zikugwira ntchito pa chipangizo chake choyamba cha 6nm Snapdragon 775G, chomwe chikuyembekezeka kukhala cholowa m'malo mwa Snapdragon 765G chip. Kuphatikiza apo, akuti akupanga chip china cha 5nm ndi chip chotsika.
Imodzi mwa mafoni oyamba kukhala ndi Snapdragon 875 ikhala mtundu wapamwamba kwambiri wamtundu wotsatira wa Samsung, malinga ndi malipoti aposachedwa osavomerezeka. Galaxy S21 (S30). Mitundu ina iyenera kugwiritsa ntchito chip kuchokera ku msonkhano wa Samsung kapena kukhazikika pa Snapdragon 865.
